Intelligence Node · AI-09
Weekly AI Briefing
SilTerra fab OEE has crossed 82% for the first time — wafer throughput is now bottlenecked by photolithography step capacity, not deposition.
SilTerra Kulim fab OEE reached 82.4%, a record, driven by the new automated CMP and inspection line. The constraint has shifted to photolithography stepper capacity on the 200mm Emerging Tech line — meaning further deposition capex will not unlock more wafer throughput. Ping Anasuria uptime remains strong at 96%, Dagang Net SLA at 99.94%, Gamuda DNeX Cloud GPU utilisation at 71%.
Adding a second i-line stepper and accelerating the equipment-engineer apprentice cohort will move the binding constraint outward and likely add another 6–8% effective wafer throughput ahead of the H2 ramp window.
Sources · Internal ERP + Bloomberg + AI scrape